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Factors Governing Tin Whisker Growth (Record no. 45358)

MARC details
000 -LEADER
fixed length control field 03522nam a22005657a 4500
001 - CONTROL NUMBER
control field sulb-eb0023266
003 - CONTROL NUMBER IDENTIFIER
control field BD-SySUS
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20160413122342.0
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION
fixed length control field cr nn 008mamaa
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 130814s2013 gw | s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9783319004709
-- 978-3-319-00470-9
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.1007/978-3-319-00470-9
Source of number or code doi
050 #4 - LIBRARY OF CONGRESS CALL NUMBER
Classification number TK7867-7867.5
072 #7 - SUBJECT CATEGORY CODE
Subject category code TJFC
Source bicssc
Subject category code TJFD5
Source bicssc
Subject category code TEC008010
Source bisacsh
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.3815
Edition number 23
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Crandall, Erika R.
Relator term author.
245 10 - TITLE STATEMENT
Title Factors Governing Tin Whisker Growth
Medium [electronic resource] /
Statement of responsibility, etc. by Erika R Crandall.
264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE
Place of production, publication, distribution, manufacture Cham :
Name of producer, publisher, distributor, manufacturer Springer International Publishing :
-- Imprint: Springer,
Date of production, publication, distribution, manufacture, or copyright notice 2013.
300 ## - PHYSICAL DESCRIPTION
Extent XII, 136 p. 92 illus., 65 illus. in color.
Other physical details online resource.
336 ## - CONTENT TYPE
Content type term text
Content type code txt
Source rdacontent
337 ## - MEDIA TYPE
Media type term computer
Media type code c
Source rdamedia
338 ## - CARRIER TYPE
Carrier type term online resource
Carrier type code cr
Source rdacarrier
347 ## - DIGITAL FILE CHARACTERISTICS
File type text file
Encoding format PDF
Source rda
490 1# - SERIES STATEMENT
Series statement Springer Theses, Recognizing Outstanding Ph.D. Research,
International Standard Serial Number 2190-5053
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note Whiskers and Their Role in Component Reliability -- Film/Substrate Effects on Whisker Growth -- Environmental Effects of Whisker Growth -- Whisker Mitigation and Prevention -- Conclusions.
520 ## - SUMMARY, ETC.
Summary, etc. Tin (Sn) whiskers are electrically conductive, single crystal eruptions that grow from Sn film surfaces. Their high aspect ratio presents reliability problems for the electronics industry due to bridging and metal arcing, leading to malfunctions and catastrophic failures in many electronic systems (including satellite and defense sectors). Due to legislation in the EU, Japan, and the U.S., mandating a gradual shift from lead (Pb)-based to lead-free solders and board finishes, there has been a reemergence of Sn whiskers. Continuing reports of Sn whisker induced failures coupled with the lack of an industry-accepted understanding of whisker growth and/or test methods to identify whisker prone products has made pure/high Sn substitutes a risky proposition in high reliability systems. This thesis is designed to clarify and control the fundamental mechanisms that govern whisker formation. The research focuses on reproducible "laboratory" created whiskers under a variety of rigorously controlled environmental factors such as film thickness, film stress, substrate material, gas environment, and humidity exposure, which are known to play a significant role in whisker production. The ultimate question of how to impede and/or prevent whisker growth is also addressed and shows that whisker prevention is possible via hard metal capping films, which are impenetrable by whiskers.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Physics.
Topical term or geographic name as entry element Surfaces (Physics).
Topical term or geographic name as entry element Interfaces (Physical sciences).
Topical term or geographic name as entry element Thin films.
Topical term or geographic name as entry element Electronic circuits.
Topical term or geographic name as entry element Metals.
Topical term or geographic name as entry element Materials
General subdivision Surfaces.
Topical term or geographic name as entry element Physics.
Topical term or geographic name as entry element Electronic Circuits and Devices.
Topical term or geographic name as entry element Circuits and Systems.
Topical term or geographic name as entry element Metallic Materials.
Topical term or geographic name as entry element Surfaces and Interfaces, Thin Films.
Topical term or geographic name as entry element Surface and Interface Science, Thin Films.
710 2# - ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element SpringerLink (Online service)
773 0# - HOST ITEM ENTRY
Title Springer eBooks
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Relationship information Printed edition:
International Standard Book Number 9783319004693
830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE
Uniform title Springer Theses, Recognizing Outstanding Ph.D. Research,
International Standard Serial Number 2190-5053
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier <a href="http://dx.doi.org/10.1007/978-3-319-00470-9">http://dx.doi.org/10.1007/978-3-319-00470-9</a>
912 ## -
-- ZDB-2-PHA
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Source of classification or shelving scheme
Koha item type

No items available.