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Structural dynamics of electronic and photonic systems / (Record no. 62488)

MARC details
000 -LEADER
fixed length control field 07034cam a2200649Ia 4500
001 - CONTROL NUMBER
control field sulb-eb0030836
003 - CONTROL NUMBER IDENTIFIER
control field BD-SySUS
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20170713221238.0
006 - FIXED-LENGTH DATA ELEMENTS--ADDITIONAL MATERIAL CHARACTERISTICS
fixed length control field m o d
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION
fixed length control field cr cn|||||||||
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 110426s2010 njua ob 001 0 eng d
040 ## - CATALOGING SOURCE
Original cataloging agency DG1
Language of cataloging eng
Transcribing agency DG1
Modifying agency MYG
-- DEBSZ
-- OCLCQ
-- OCLCA
-- OCLCQ
-- OCLCF
-- OCLCQ
-- BD-SySUS
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9780470950012
Qualifying information (electronic bk.)
International Standard Book Number 0470950013
Qualifying information (electronic bk.)
International Standard Book Number 9780470250020
International Standard Book Number 047025002X
024 7# - OTHER STANDARD IDENTIFIER
Standard number or code 10.1002/9780470950012
Source of number or code doi
029 1# - OTHER SYSTEM CONTROL NUMBER (OCLC)
OCLC library identifier AU@
System control number 000049641561
OCLC library identifier DEBSZ
System control number 347987028
OCLC library identifier NZ1
System control number 13876195
OCLC library identifier NZ1
System control number 15341290
OCLC library identifier DEBBG
System control number BV043392982
035 ## - SYSTEM CONTROL NUMBER
System control number (OCoLC)714797067
037 ## - SOURCE OF ACQUISITION
Stock number 10.1002/9780470950012
Source of stock number/acquisition Wiley InterScience
Note http://www3.interscience.wiley.com
050 14 - LIBRARY OF CONGRESS CALL NUMBER
Classification number TK7870.23
Item number .S77 2010
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.382
Edition number 22
049 ## - LOCAL HOLDINGS (OCLC)
Holding library MAIN
245 00 - TITLE STATEMENT
Title Structural dynamics of electronic and photonic systems /
Statement of responsibility, etc. edited by Ephraim Suhir, T.X. Yu, Eric Connally.
260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT)
Place of publication, distribution, etc. Hoboken, N.J. :
Name of publisher, distributor, etc. Wiley,
Date of publication, distribution, etc. 2010.
300 ## - PHYSICAL DESCRIPTION
Extent 1 online resource (x, 598 pages) :
Other physical details illustrations
336 ## - CONTENT TYPE
Content type term text
Content type code txt
Source rdacontent
337 ## - MEDIA TYPE
Media type term computer
Media type code c
Source rdamedia
338 ## - CARRIER TYPE
Carrier type term online resource
Carrier type code cr
Source rdacarrier
504 ## - BIBLIOGRAPHY, ETC. NOTE
Bibliography, etc Includes bibliographical references and index.
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note Frontmatter -- Some Major Structural Dynamics-Related Failure Modes and Mechanisms in Micro- and Opto-Electronic Systems and Dynamic Stability of These Systems / David S Steinberg -- Linear Response to Shocks and Vibrations / Ephraim Suhir -- Linear and Nonlinear Vibrations Caused by Periodic Impulses / Ephraim Suhir -- Random Vibrations of Structural Elements in Electronic and Photonic Systems / Ephraim Suhir -- Natural Frequencies and Failure Mechanisms of Electronic and Photonic Structures Subjected to Sinusoidal or Random Vibrations / David S Steinberg -- Drop/Impact of Typical Portable Electronic Devices: Experimentation and Modeling / T X Yu, C Y Zhou -- Shock Test Methods and Test Standards for Portable Electronic Devices / C Y Zhou, T X Yu, S W Ricky Lee, Ephraim Suhir -- Dynamic Response of Solder Joint Interconnections to Vibration and Shock / David S Steinberg -- Test Equipment, Test Methods, Test Fixtures, and Test Sensors for Evaluating Electronic Equipment / David S Steinberg -- Correlation between Package-Level High-Speed Solder Ball Shear/Pull and Board-Level Mechanical Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy / Fubin Song, S W Ricky Lee, Keith Newman, Bob Sykes, Stephen Clark -- Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging / V B C Tan, K C Ong, C T Lim, J E Field -- Fatigue Damage Evaluation for Microelectronic Components Subjected to Vibration / T E Wong -- Vibration Considerations for Sensitive Research and Production Facilities / E E Ungar, H Amick, J A Zapfe -- Applications of Finite Element Analysis: Attributes and Challenges / Metin Ozen -- Shock Simulation of Drop Test of Hard Disk Drives / D W Shu, B J Shi, J Luo -- Shock Protection of Portable Electronic Devices Using a ₃Cushion₄ of an Array of Wires (AOW) / Ephraim Suhir -- Board-Level Reliability of Lead-Free Solder under Mechanical Shock and Vibration Loads / Toni T Matilla, Pekka Marjamaki, Jorma Kivilahti -- Dynamic Response of PCB Structures to Shock Loading in Reliability Tests / Milena Vujosevic, Ephraim Suhir -- Linear Response of Single-Degree-of-Freedom System to Impact Load: Could Shock Tests Adequately Mimic Drop Test Conditions? / Ephraim Suhir -- Shock Isolation of Micromachined Device for High- Applications / Sang-Hee Yoon, Jin-Eep Roh, Ki Lyug Kim -- Reliability Assessment of Microelectronics Packages Using Dynamic Testing Methods / X Q Shi, G Y Li, Q J Yang -- Thermal Cycle and Vibration/Drop Reliability of Area Array Package Assemblies / Reza Ghaffarian -- Could an Impact Load of Finite Duration Be Substituted with an Instantaneous Impulse? / Ephraim Suhir, Luciano Arruda -- Index.
520 ## - SUMMARY, ETC.
Summary, etc. "The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components' level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice"--
Assigning source Provided by publisher.
Summary, etc. "The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading"--
Assigning source Provided by publisher.
533 ## - REPRODUCTION NOTE
Type of reproduction Electronic reproduction.
Place of reproduction Hoboken, N.J. :
Agency responsible for reproduction Wiley InterScience,
Date of reproduction 2011.
Note about reproduction Mode of access: World Wide Web.
-- System requirements: Web browser.
-- Title from title screen (viewed on Apr. 21, 2011).
-- Access may be restricted to users at subscribing institutions.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Electronic apparatus and appliances
General subdivision Reliability.
Topical term or geographic name as entry element Optoelectronic devices
General subdivision Reliability.
Topical term or geographic name as entry element Fault tolerance (Engineering)
Topical term or geographic name as entry element Microstructure.
Topical term or geographic name as entry element Structural dynamics.
Topical term or geographic name as entry element Electronic apparatus and appliances
General subdivision Reliability.
Source of heading or term fast
Authority record control number (OCoLC)fst00906827
Topical term or geographic name as entry element Fault tolerance (Engineering)
Source of heading or term fast
Authority record control number (OCoLC)fst00921986
Topical term or geographic name as entry element Microstructure.
Source of heading or term fast
Authority record control number (OCoLC)fst01020118
Topical term or geographic name as entry element Optoelectronic devices
General subdivision Reliability.
Source of heading or term fast
Authority record control number (OCoLC)fst01046916
Topical term or geographic name as entry element Structural dynamics.
Source of heading or term fast
Authority record control number (OCoLC)fst01135648
655 #4 - INDEX TERM--GENRE/FORM
Genre/form data or focus term Electronic books.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Suhir, Ephraim.
Personal name Yu, T. X.
Fuller form of name (Tongxi),
Dates associated with a name 1941-
Personal name Connally, Eric.
710 2# - ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element Wiley InterScience (Online service)
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Relationship information Print version:
Title Structural dynamics of electronic and photonic systems.
Place, publisher, and date of publication Hoboken, N.J. : Wiley, 2010
International Standard Book Number 9780470250020
Record control number (DLC) 2010031072
-- (OCoLC)642840093
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier <a href="http://onlinelibrary.wiley.com/book/10.1002/9780470950012">http://onlinelibrary.wiley.com/book/10.1002/9780470950012</a>
Public note Wiley Online Library [Free Download only for SUST IP]
994 ## -
-- 92
-- DG1

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