Handbook of wafer bonding / (Record no. 63191)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 05183cam a2200829Ia 4500 |
| 001 - CONTROL NUMBER | |
| control field | sulb-eb0031539 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | BD-SySUS |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20170713221302.0 |
| 006 - FIXED-LENGTH DATA ELEMENTS--ADDITIONAL MATERIAL CHARACTERISTICS | |
| fixed length control field | m o d |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION | |
| fixed length control field | cr cn||||||||| |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 120309s2012 gw a obf 001 0 eng d |
| 040 ## - CATALOGING SOURCE | |
| Original cataloging agency | DG1 |
| Language of cataloging | eng |
| Description conventions | pn |
| Transcribing agency | DG1 |
| Modifying agency | E7B |
| -- | YDXCP |
| -- | GZM |
| -- | OCLCO |
| -- | DEBSZ |
| -- | OCLCQ |
| -- | N$T |
| -- | OCLCF |
| -- | OCLCQ |
| -- | CDX |
| -- | COO |
| -- | OCL |
| -- | OCLCQ |
| -- | AZK |
| -- | DG1 |
| -- | BD-SySUS |
| 019 ## - | |
| -- | 785777901 |
| -- | 794707297 |
| -- | 961632813 |
| -- | 962650779 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9783527644247 |
| Qualifying information | (electronic bk.) |
| International Standard Book Number | 3527644245 |
| Qualifying information | (electronic bk.) |
| Canceled/invalid ISBN | 3527644245 |
| Canceled/invalid ISBN | 9783527644223 |
| Canceled/invalid ISBN | 3527644229 |
| Canceled/invalid ISBN | 9783527644230 |
| Canceled/invalid ISBN | 3527644237 |
| Canceled/invalid ISBN | 9783527644254 |
| Canceled/invalid ISBN | 3527644253 |
| Canceled/invalid ISBN | 3527326464 |
| Canceled/invalid ISBN | 9783527326464 |
| 029 1# - OTHER SYSTEM CONTROL NUMBER (OCLC) | |
| OCLC library identifier | AU@ |
| System control number | 000049013971 |
| OCLC library identifier | AU@ |
| System control number | 000053017069 |
| OCLC library identifier | DEBBG |
| System control number | BV041829410 |
| OCLC library identifier | DEBSZ |
| System control number | 372696236 |
| OCLC library identifier | DKDLA |
| System control number | 820120-katalog:000600708 |
| OCLC library identifier | NZ1 |
| System control number | 14696616 |
| OCLC library identifier | NZ1 |
| System control number | 15340966 |
| 035 ## - SYSTEM CONTROL NUMBER | |
| System control number | (OCoLC)779616373 |
| Canceled/invalid control number | (OCoLC)785777901 |
| -- | (OCoLC)794707297 |
| -- | (OCoLC)961632813 |
| -- | (OCoLC)962650779 |
| 037 ## - SOURCE OF ACQUISITION | |
| Stock number | 10.1002/9783527644223 |
| Source of stock number/acquisition | Wiley InterScience |
| Note | http://www3.interscience.wiley.com |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | QC611.6.S9 |
| Item number | H36 2012 |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TEC |
| Subject category code subdivision | 008090 |
| Source | bisacsh |
| Subject category code | TEC |
| Subject category code subdivision | 008100 |
| Source | bisacsh |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.38152 |
| Edition number | 22 |
| 049 ## - LOCAL HOLDINGS (OCLC) | |
| Holding library | MAIN |
| 245 00 - TITLE STATEMENT | |
| Title | Handbook of wafer bonding / |
| Statement of responsibility, etc. | edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) | |
| Place of publication, distribution, etc. | Weinheim : |
| Name of publisher, distributor, etc. | Wiley-VCH, |
| Date of publication, distribution, etc. | ©2012. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 1 online resource (xxxi, 395 pages) : |
| Other physical details | illustrations (some color) |
| 336 ## - CONTENT TYPE | |
| Content type term | text |
| Content type code | txt |
| Source | rdacontent |
| 337 ## - MEDIA TYPE | |
| Media type term | computer |
| Media type code | c |
| Source | rdamedia |
| 338 ## - CARRIER TYPE | |
| Carrier type term | online resource |
| Carrier type code | cr |
| Source | rdacarrier |
| 347 ## - DIGITAL FILE CHARACTERISTICS | |
| File type | data file |
| Source | rda |
| 380 ## - FORM OF WORK | |
| Form of work | Bibliography |
| Form of work | Handbook |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Front Matter -- Technologies. Glass Frit Wafer Bonding / Roy Knechtel -- Wafer Bonding Using Spin-On Glass as Bonding Material / Viorel Dragoi -- Polymer Adhesive Wafer Bonding / Frank Niklaus, Jian-Qiang Lu -- Anodic Bonding / Adriana Cozma Lapadatu, Kari Schj̜lberg-Henriksen -- Direct Wafer Bonding / Manfred Reiche, Ulrich G̲sele -- Plasma-Activated Bonding / Maik Wiemer, Dirk Wuensch, Joerg Braeuer, Thomas Gessner -- Au/Sn Solder / Hermann Oppermann, Matthias Hutter -- Eutectic Au?In Bonding / Mitsumasa Koyanagi, Makoto Motoyoshi -- Thermocompression Cu?Cu Bonding of Blanket and Patterned Wafers / Kuan-Neng Chen, Chuan Seng Tan -- Wafer-Level Solid₆Liquid Interdiffusion Bonding / Nils Hoivik, Knut Aasmundtveit -- Hybrid Metal/Polymer Wafer Bonding Platform / Jian-Qiang Lu, J Jay McMahon, Ronald J Gutmann -- Cu/SiO Hybrid Bonding / Ľa Di Cioccio -- Metal/Silicon Oxide Hybrid Bonding / Paul Enquist -- Applications. Microelectromechanical Systems / Maaike M V Taklo -- Three-Dimensional Integration / Philip Garrou, James Jian-Qiang Lu, Peter Ramm -- Temporary Bonding for Enabling Three-Dimensional Integration and Packaging / Rama Puligadda -- Temporary Adhesive Bonding with Reconfiguration of Known Good Dies for Three-Dimensional Integrated Systems / Armin Klumpp, Peter Ramm -- Thin Wafer Support System for above 250ʻC Processing and Cold De-Bonding / Werner Pamler, Franz Richter -- Temporary Bonding: Electrostatic / Christof Landesberger, Armin Klumpp, Karlheinz Bock -- Index. |
| 500 ## - GENERAL NOTE | |
| General note | Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices. |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE | |
| Bibliography, etc | Includes bibliographical references and index. |
| 588 0# - SOURCE OF DESCRIPTION NOTE | |
| Source of description note | Print version record. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Semiconductor wafers |
| Form subdivision | Handbooks, manuals, etc. |
| Topical term or geographic name as entry element | Semiconductors |
| General subdivision | Bonding |
| Form subdivision | Handbooks, manuals, etc. |
| Topical term or geographic name as entry element | TECHNOLOGY & ENGINEERING |
| General subdivision | Electronics |
| -- | Semiconductors. |
| Source of heading or term | bisacsh |
| Topical term or geographic name as entry element | TECHNOLOGY & ENGINEERING |
| General subdivision | Electronics |
| -- | Solid State. |
| Source of heading or term | bisacsh |
| Topical term or geographic name as entry element | Semiconductor wafers. |
| Source of heading or term | fast |
| Authority record control number | (OCoLC)fst01112189 |
| Topical term or geographic name as entry element | Semiconductors |
| General subdivision | Bonding. |
| Source of heading or term | fast |
| Authority record control number | (OCoLC)fst01112201 |
| 655 #4 - INDEX TERM--GENRE/FORM | |
| Genre/form data or focus term | Electronic books. |
| Genre/form data or focus term | Handbooks and manuals. |
| Source of term | fast |
| Authority record control number | (OCoLC)fst01423877 |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Ramm, Peter. |
| Personal name | Lu, James Jian-Qiang. |
| Personal name | Taklo, Maaike M. V. |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Relationship information | Print version: |
| Title | Handbook of wafer bonding. |
| Place, publisher, and date of publication | Weinheim : Wiley-VCH, ©2012 |
| International Standard Book Number | 9783527326464 |
| Record control number | (OCoLC)781684626 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | <a href="http://onlinelibrary.wiley.com/book/10.1002/9783527644223">http://onlinelibrary.wiley.com/book/10.1002/9783527644223</a> |
| Public note | Wiley Online Library [Free Download only for SUST IP] |
| 938 ## - | |
| -- | Coutts Information Services |
| -- | COUT |
| -- | 22580432 |
| -- | ebrary |
| -- | EBRY |
| -- | ebr10529302 |
| -- | EBSCOhost |
| -- | EBSC |
| -- | 510206 |
| -- | YBP Library Services |
| -- | YANK |
| -- | 7425094 |
| -- | YBP Library Services |
| -- | YANK |
| -- | 7484189 |
| -- | YBP Library Services |
| -- | YANK |
| -- | 12679405 |
| 994 ## - | |
| -- | 92 |
| -- | DG1 |
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