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Advanced Flip Chip Packaging [electronic resource] / edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong.

Contributor(s): Material type: TextTextPublisher: Boston, MA : Springer US : Imprint: Springer, 2013Description: VII, 560 p. 413 illus., 242 illus. in color. online resourceContent type:
  • text
Media type:
  • computer
Carrier type:
  • online resource
ISBN:
  • 9781441957689
Subject(s): Additional physical formats: Printed edition:: No titleDDC classification:
  • 621.381 23
LOC classification:
  • TK7800-8360
  • TK7874-7874.9
Online resources:
Contents:
Flip Chip Technology Overview and Early Beginnings -- Technology Trends of Flip Chip -- Bumping Technologies -- Flip-Chip Interconnections: Past, Present and Future -- Underfill -- Conductive Adhesives for Flip Chip Applications -- Enabling Substrate Technologies: Past, Present and Future -- IC-Package-System Integrated Design -- Thermal Management of Flip Chip Packages -- Thermo-Mechanical Reliability in Flip Chip Packages --  Interfacial Reactions and Electromigration in Flip-Chip Solder Joints.
In: Springer eBooksSummary: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.
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Flip Chip Technology Overview and Early Beginnings -- Technology Trends of Flip Chip -- Bumping Technologies -- Flip-Chip Interconnections: Past, Present and Future -- Underfill -- Conductive Adhesives for Flip Chip Applications -- Enabling Substrate Technologies: Past, Present and Future -- IC-Package-System Integrated Design -- Thermal Management of Flip Chip Packages -- Thermo-Mechanical Reliability in Flip Chip Packages --  Interfacial Reactions and Electromigration in Flip-Chip Solder Joints.

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging.

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