TY  - BOOK
AU  - Silva,Lucas F.M.da
AU  - Sato,Chiaki
ED  - SpringerLink (Online service)
TI  - Design of Adhesive Joints Under Humid Conditions
T2  - Advanced Structured Materials,
SN  - 9783642376146
AV  - TA418.7-418.76 
U1  - 620.44 23
PY  - 2013///
CY  - Berlin, Heidelberg
PB  - Springer Berlin Heidelberg, Imprint: Springer
KW  - Materials science
KW  - Polymers
KW  - Continuum mechanics
KW  - Aerospace engineering
KW  - Astronautics
KW  - Materials
KW  - Surfaces
KW  - Thin films
KW  - Materials Science
KW  - Surfaces and Interfaces, Thin Films
KW  - Continuum Mechanics and Mechanics of Materials
KW  - Polymer Sciences
KW  - Aerospace Technology and Astronautics
N1  - Diffusion of moisture in adhesives -- Diffusion of moisture in interfaces -- Surface treatments for moisture resistance -- Influence of moisture on the adhesive properties -- Influence of water on the interface properties -- Prediction of joint strength under humid conditions: Continuum mechanics approach -- Prediction of joint strength under humid conditions: Fracture mechanics approach -- Prediction of joint strength under humid conditions: Damage mechanics approach
N2  - This book describes most recent advances and limitations concerning design of adhesive joints under humid conditions and discusses future trends. It  presents new approaches to predict the failure load after exposure to load, temperature and humidity over a long period of time. With the rapid increase in numerical computing power there have been attempts to formalize the different environmental contributions in order to provide a procedure to predict assembly durability, based on an initial identification of diffusion coefficients and mechanical parameters for both the adhesive and the interface. A coupled numerical model for the joint of interest is then constructed and this allows local water content to be defined and resulting changes in adhesive and interface properties to be predicted
UR  - http://dx.doi.org/10.1007/978-3-642-37614-6
ER  -