TY - BOOK AU - Tong,Ho-Ming AU - Lai,Yi-Shao AU - Wong,C.P. ED - SpringerLink (Online service) TI - Advanced Flip Chip Packaging SN - 9781441957689 AV - TK7800-8360 U1 - 621.381 23 PY - 2013/// CY - Boston, MA PB - Springer US, Imprint: Springer KW - Engineering KW - Electronics KW - Microelectronics KW - Electronic circuits KW - Optical materials KW - Electronic materials KW - Electronics and Microelectronics, Instrumentation KW - Circuits and Systems KW - Optical and Electronic Materials N1 - Flip Chip Technology Overview and Early Beginnings -- Technology Trends of Flip Chip -- Bumping Technologies -- Flip-Chip Interconnections: Past, Present and Future -- Underfill -- Conductive Adhesives for Flip Chip Applications -- Enabling Substrate Technologies: Past, Present and Future -- IC-Package-System Integrated Design -- Thermal Management of Flip Chip Packages -- Thermo-Mechanical Reliability in Flip Chip Packages --  Interfacial Reactions and Electromigration in Flip-Chip Solder Joints N2 - Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging UR - http://dx.doi.org/10.1007/978-1-4419-5768-9 ER -