Advanced interconnects for ULSI technology / [edited by] Mikhail Baklanov, Paul S. Ho, Ehrenfried Zschech.
Material type: TextPublication details: Hoboken, NJ : Wiley, 2012.Description: 1 online resourceContent type:- text
- computer
- online resource
- 9781119963240
- 1119963249
- 9781119963677
- 1119963672
- 1280590807
- 9781280590801
- Interconnects (Integrated circuit technology)
- Integrated circuits -- Ultra large scale integration
- Integrated circuits -- Ultra large scale integration
- Interconnects (Integrated circuit technology)
- TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- VLSI & ULSI
- COMPUTERS -- Logic Design
- TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- Logic
- Integrated circuits -- Ultra large scale integration
- Interconnects (Integrated circuit technology)
- 621.39/5 23
- TK7874.53 .A39 2012eb
"This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"-- Provided by publisher.
Includes bibliographical references and index.
Print version record.
Front Matter -- Colour Plates -- Section I: Low-. Low- Materials: Recent Advances / Geraud Dubois, Willi Volksen -- Ultra-Low- by CVD: Deposition and Curing / Vincent Jousseaume, Aziz Zenasni, Olivier Gourhant, Laurent Favennec, Mikhail R Baklanov -- Plasma Processing of Low- Dielectrics / Hualiang Shi, Denis Shamiryan, Jean-Fraṅois de Marneffe, Huai Huang, Paul S Ho, Mikhail R Baklanov -- Wet Clean Applications in Porous Low- Patterning Processes / Quoc Toan Le, Guy Vereecke, Herbert Struyf, Els Kesters, Mikhail R Baklanov -- Section II: Conductive Layers and Barriers. Copper Electroplating for On-Chip Metallization / Valery M Dubin -- Diffusion Barriers / Michael Hecker, Rene Hubner -- Section III: Integration and Reliability. Process Integration of Interconnects / Sridhar Balakrishnan, Ruth Brain, Larry Zhao -- Chemical Mechanical Planarization for Cu₆Low- Integration / Gautam Banerjee -- Scaling and Microstructure Effects on Electromigration Reliability for Cu Interconnects / Chao-Kun Hu, Rene Hubner, Lijuan Zhang, Meike Hauschildt, Paul S Ho -- Mechanical Reliability of Low- Dielectrics / Kris Vanstreels, Han Li, Joost J Vlassak -- Electrical Breakdown in Advanced Interconnect Dielectrics / Ennis T Ogawa, Oliver Aubel -- Section IV: New Approaches. 3D Interconnect Technology / John U Knickerbocker, Lay Wai Kong, Sven Niese, Alain Diebold, Ehrenfried Zschech -- Carbon Nanotubes for Interconnects / Mizuhisa Nihei, Motonobu Sato, Akio Kawabata, Shintaro Sato, Yuji Awano -- Optical Interconnects / Wim Bogaerts -- Wireless Interchip Interconnects / Takamaro Kikkawa -- Index.
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