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1.
Handbook of wafer bonding / edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo. by
  • Ramm, Peter
  • Lu, James Jian-Qiang
  • Taklo, Maaike M. V
Material type: Text Text; Format: available online remote; Literary form: Not fiction
Publication details: Weinheim : Wiley-VCH, ©2012
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Availability: No items available.

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2.
Handbook of 3D Integration : 3D process technology / edited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm. by
  • Garrou, Philip E [editor.]
  • Koyanagi, Mitsumasa [editor.]
  • Ramm, Peter [editor.]
Material type: Text Text; Format: available online remote; Literary form: Not fiction
Publisher: Weinheim, Germany : Wiley-VCH, 2014
Online access:
Availability: No items available.

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