000			03522nam a22005657a 4500
001			sulb-eb0023266
003			BD-SySUS
005			20160413122342.0
007			cr nn 008mamaa
008			130814s2013 gw | s |||| 0|eng d
020			_a9783319004709 _9978-3-319-00470-9
024	7		_a10.1007/978-3-319-00470-9 _2doi
050		4	_aTK7867-7867.5
072		7	_aTJFC _2bicssc
072		7	_aTJFD5 _2bicssc
072		7	_aTEC008010 _2bisacsh
082	0	4	_a621.3815 _223
100	1		_aCrandall, Erika R. _eauthor.
245	1	0	_aFactors Governing Tin Whisker Growth _h[electronic resource] / _cby Erika R Crandall.
264		1	_aCham : _bSpringer International Publishing : _bImprint: Springer, _c2013.
300			_aXII, 136 p. 92 illus., 65 illus. in color. _bonline resource.
336			_atext _btxt _2rdacontent
337			_acomputer _bc _2rdamedia
338			_aonline resource _bcr _2rdacarrier
347			_atext file _bPDF _2rda
490	1		_aSpringer Theses, Recognizing Outstanding Ph.D. Research, _x2190-5053
505	0		_aWhiskers and Their Role in Component Reliability -- Film/Substrate Effects on Whisker Growth -- Environmental Effects of Whisker Growth -- Whisker Mitigation and Prevention -- Conclusions.
520			_aTin (Sn) whiskers are electrically conductive, single crystal eruptions that grow from Sn film surfaces. Their high aspect ratio presents reliability problems for the electronics industry due to bridging and metal arcing, leading to malfunctions and catastrophic failures in many electronic systems (including satellite and defense sectors). Due to legislation in the EU, Japan, and the U.S., mandating a gradual shift from lead (Pb)-based to lead-free solders and board finishes, there has been a reemergence of Sn whiskers. Continuing reports of Sn whisker induced failures coupled with the lack of an industry-accepted understanding of whisker growth and/or test methods to identify whisker prone products has made pure/high Sn substitutes a risky proposition in high reliability systems. This thesis is designed to clarify and control the fundamental mechanisms that govern whisker formation. The research focuses on reproducible "laboratory" created whiskers under a variety of rigorously controlled environmental factors such as film thickness, film stress, substrate material, gas environment, and humidity exposure, which are known to play a significant role in whisker production. The ultimate question of how to impede and/or prevent whisker growth is also addressed and shows that whisker prevention is possible via hard metal capping films, which are impenetrable by whiskers.
650		0	_aPhysics.
650		0	_aSurfaces (Physics).
650		0	_aInterfaces (Physical sciences).
650		0	_aThin films.
650		0	_aElectronic circuits.
650		0	_aMetals.
650		0	_aMaterials _xSurfaces.
650	1	4	_aPhysics.
650	2	4	_aElectronic Circuits and Devices.
650	2	4	_aCircuits and Systems.
650	2	4	_aMetallic Materials.
650	2	4	_aSurfaces and Interfaces, Thin Films.
650	2	4	_aSurface and Interface Science, Thin Films.
710	2		_aSpringerLink (Online service)
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9783319004693
830		0	_aSpringer Theses, Recognizing Outstanding Ph.D. Research, _x2190-5053
856	4	0	_uhttp://dx.doi.org/10.1007/978-3-319-00470-9
912			_aZDB-2-PHA
942			_2Dewey Decimal Classification _ceBooks
999			_c45358 _d45358