000 01268nam a22002897a 4500
001 sulbI000277
003 BD-SySUS
005 20160525141754.0
008 160525s2007 nyua b 001 0 eng d
020 _a0387279741 (hbk.)
020 _a9780387279749 (hbk.)
040 _aUKM
_cUKM
_dBAKER
_dNDD
_dYDXCP
_dDLC
_dBD-SySUS
082 0 0 _a621.381
_222
_bMIC
245 0 0 _aMicro- and opto-electronic materials and structures :
_bphysics, mechanics, design, reliability, packaging /
_cedited by E. Suhir, Y.C. Lee, C.P. Wong.
260 _aNew York :
_bSpringer,
_cc2007.
300 _aVol. 2; xxx, 735 p. :
_bill. ;
_c26 cm.
505 0 _av.1. Materials physics/Materials mechanics -- v.2. Physical design/Reliability and packaging.
650 0 _aMicroelectronics.
_915452
650 0 _aOptoelectronics.
_915390
700 1 _aSuhir, Ephraim.
_926070
700 1 _aLee, Y. C.
_926071
700 1 _aWong, C. P.,
_d1947-
_926072
856 4 2 _3Contributor biographical information
_uhttp://www.loc.gov/catdir/enhancements/fy0819/2006922729-b.html
856 4 2 _3Publisher description
_uhttp://www.loc.gov/catdir/enhancements/fy0819/2006922729-d.html
856 4 1 _3Table of contents only
_uhttp://www.loc.gov/catdir/enhancements/fy0819/2006922729-t.html
942 _2ddc
_cBK
999 _c61183
_d61183