Advanced Flip Chip Packaging (Record no. 43406)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 03248nam a22005417a 4500 |
| 001 - CONTROL NUMBER | |
| control field | sulb-eb0021314 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | BD-SySUS |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20160413122139.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION | |
| fixed length control field | cr nn 008mamaa |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 130321s2013 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9781441957689 |
| -- | 978-1-4419-5768-9 |
| 024 7# - OTHER STANDARD IDENTIFIER | |
| Standard number or code | 10.1007/978-1-4419-5768-9 |
| Source of number or code | doi |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | TK7800-8360 |
| Classification number | TK7874-7874.9 |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TJF |
| Source | bicssc |
| Subject category code | TEC008000 |
| Source | bisacsh |
| Subject category code | TEC008070 |
| Source | bisacsh |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 621.381 |
| Edition number | 23 |
| 245 10 - TITLE STATEMENT | |
| Title | Advanced Flip Chip Packaging |
| Medium | [electronic resource] / |
| Statement of responsibility, etc. | edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
| Place of production, publication, distribution, manufacture | Boston, MA : |
| Name of producer, publisher, distributor, manufacturer | Springer US : |
| -- | Imprint: Springer, |
| Date of production, publication, distribution, manufacture, or copyright notice | 2013. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | VII, 560 p. 413 illus., 242 illus. in color. |
| Other physical details | online resource. |
| 336 ## - CONTENT TYPE | |
| Content type term | text |
| Content type code | txt |
| Source | rdacontent |
| 337 ## - MEDIA TYPE | |
| Media type term | computer |
| Media type code | c |
| Source | rdamedia |
| 338 ## - CARRIER TYPE | |
| Carrier type term | online resource |
| Carrier type code | cr |
| Source | rdacarrier |
| 347 ## - DIGITAL FILE CHARACTERISTICS | |
| File type | text file |
| Encoding format | |
| Source | rda |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Flip Chip Technology Overview and Early Beginnings -- Technology Trends of Flip Chip -- Bumping Technologies -- Flip-Chip Interconnections: Past, Present and Future -- Underfill -- Conductive Adhesives for Flip Chip Applications -- Enabling Substrate Technologies: Past, Present and Future -- IC-Package-System Integrated Design -- Thermal Management of Flip Chip Packages -- Thermo-Mechanical Reliability in Flip Chip Packages -- Interfacial Reactions and Electromigration in Flip-Chip Solder Joints. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc. | Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also: Offers broad-ranging chapters with a focus on IC-package-system integration Provides viewpoints from leading industry executives and experts Details state-of-the-art achievements in process technologies and scientific research Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Engineering. |
| Topical term or geographic name as entry element | Electronics. |
| Topical term or geographic name as entry element | Microelectronics. |
| Topical term or geographic name as entry element | Electronic circuits. |
| Topical term or geographic name as entry element | Optical materials. |
| Topical term or geographic name as entry element | Electronic materials. |
| Topical term or geographic name as entry element | Engineering. |
| Topical term or geographic name as entry element | Electronics and Microelectronics, Instrumentation. |
| Topical term or geographic name as entry element | Circuits and Systems. |
| Topical term or geographic name as entry element | Optical and Electronic Materials. |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | Tong, Ho-Ming. |
| Relator term | editor. |
| Personal name | Lai, Yi-Shao. |
| Relator term | editor. |
| Personal name | Wong, C.P. |
| Relator term | editor. |
| 710 2# - ADDED ENTRY--CORPORATE NAME | |
| Corporate name or jurisdiction name as entry element | SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY | |
| Title | Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Relationship information | Printed edition: |
| International Standard Book Number | 9781441957672 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | <a href="http://dx.doi.org/10.1007/978-1-4419-5768-9">http://dx.doi.org/10.1007/978-1-4419-5768-9</a> |
| 912 ## - | |
| -- | ZDB-2-ENG |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Source of classification or shelving scheme | |
| Koha item type | |
No items available.