Electromigration Modeling at Circuit Layout Level (Record no. 49143)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 02868nam a22005657a 4500 |
| 001 - CONTROL NUMBER | |
| control field | sulb-eb0027051 |
| 003 - CONTROL NUMBER IDENTIFIER | |
| control field | BD-SySUS |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20160413122726.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION | |
| fixed length control field | cr nn 008mamaa |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 130321s2013 si | s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9789814451215 |
| -- | 978-981-4451-21-5 |
| 024 7# - OTHER STANDARD IDENTIFIER | |
| Standard number or code | 10.1007/978-981-4451-21-5 |
| Source of number or code | doi |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | TA169.7 |
| Classification number | T55-T55.3 |
| Classification number | TA403.6 |
| 072 #7 - SUBJECT CATEGORY CODE | |
| Subject category code | TGPR |
| Source | bicssc |
| Subject category code | TEC032000 |
| Source | bisacsh |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER | |
| Classification number | 658.56 |
| Edition number | 23 |
| 100 1# - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Tan, Cher Ming. |
| Relator term | author. |
| 245 10 - TITLE STATEMENT | |
| Title | Electromigration Modeling at Circuit Layout Level |
| Medium | [electronic resource] / |
| Statement of responsibility, etc. | by Cher Ming Tan, Feifei He. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
| Place of production, publication, distribution, manufacture | Singapore : |
| Name of producer, publisher, distributor, manufacturer | Springer Singapore : |
| -- | Imprint: Springer, |
| Date of production, publication, distribution, manufacture, or copyright notice | 2013. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | IX, 103 p. 75 illus., 2 illus. in color. |
| Other physical details | online resource. |
| 336 ## - CONTENT TYPE | |
| Content type term | text |
| Content type code | txt |
| Source | rdacontent |
| 337 ## - MEDIA TYPE | |
| Media type term | computer |
| Media type code | c |
| Source | rdamedia |
| 338 ## - CARRIER TYPE | |
| Carrier type term | online resource |
| Carrier type code | cr |
| Source | rdacarrier |
| 347 ## - DIGITAL FILE CHARACTERISTICS | |
| File type | text file |
| Encoding format | |
| Source | rda |
| 490 1# - SERIES STATEMENT | |
| Series statement | SpringerBriefs in Applied Sciences and Technology, |
| International Standard Serial Number | 2191-530X |
| 505 0# - FORMATTED CONTENTS NOTE | |
| Formatted contents note | Introduction -- 3D Circuit Model Construction and Simulation -- Comparison of EM Performance in Circuit Structure and Test Structure -- Interconnect EM Reliability Modeling at Circuit Layout Level -- Conclusion. |
| 520 ## - SUMMARY, ETC. | |
| Summary, etc. | Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level. . |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Engineering. |
| Topical term or geographic name as entry element | Atoms. |
| Topical term or geographic name as entry element | Physics. |
| Topical term or geographic name as entry element | Electronic circuits. |
| Topical term or geographic name as entry element | Quality control. |
| Topical term or geographic name as entry element | Reliability. |
| Topical term or geographic name as entry element | Industrial safety. |
| Topical term or geographic name as entry element | Engineering. |
| Topical term or geographic name as entry element | Quality Control, Reliability, Safety and Risk. |
| Topical term or geographic name as entry element | Electronic Circuits and Devices. |
| Topical term or geographic name as entry element | Atomic, Molecular, Optical and Plasma Physics. |
| 700 1# - ADDED ENTRY--PERSONAL NAME | |
| Personal name | He, Feifei. |
| Relator term | author. |
| 710 2# - ADDED ENTRY--CORPORATE NAME | |
| Corporate name or jurisdiction name as entry element | SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY | |
| Title | Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY | |
| Relationship information | Printed edition: |
| International Standard Book Number | 9789814451208 |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE | |
| Uniform title | SpringerBriefs in Applied Sciences and Technology, |
| International Standard Serial Number | 2191-530X |
| 856 40 - ELECTRONIC LOCATION AND ACCESS | |
| Uniform Resource Identifier | <a href="http://dx.doi.org/10.1007/978-981-4451-21-5">http://dx.doi.org/10.1007/978-981-4451-21-5</a> |
| 912 ## - | |
| -- | ZDB-2-ENG |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Source of classification or shelving scheme | |
| Koha item type | |
No items available.